Deep Red Thermal Interface Material For Telecommunication Hardware

Product Categories

Phase Changing Materials [41]
Thermal Conductive Pad [189]
Thermal Gap Filler [210]
Thermal Conductive Grease [28]
Thermal Insulation Materials [49]
Thermal Graphite Sheet [57]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [23]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Deep Red Thermal Interface Material For Telecommunication Hardware

Contact Now

Deep Red Thermal Interface Material For Telecommunication Hardware

Thermal Gap Filler in Telecommunication hardware The TIF100-03Fthermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or ...

Product Tags:

thermally conductive filler

thermal conductivity silicone

Thermal Gap Filler Deep Red

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!