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4.0W/mK Heat Sink Silicone Thermal Conductive Putty

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4.0W/mK Heat Sink Silicone Thermal Conductive Putty

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Brand Name : ZIITEK

Model Number : TIF040AB-12S

Certification : UL

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Name : 4.0W/mK Heat Sink Silicone Thermal Conductive Putty

Color : White / blue

keyword : thermal conductive Putty

Applications : Tablet Computer

Material : Silicone

Thermal conductivity : 4.0W/mK

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4.0W/mK Heat Sink Silicone Thermal Conductive Putty

Company Profile

With professional R&D capabilities and over 18 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

TIF040AB-12S-Datasheet-REV02.pdf

4.0W/mK Heat Sink Silicone Thermal Conductive Putty

Ziitek TIF040AB-12S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.

< Good thermal conductive: 4.0W/mK

< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing

Applications

< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor

Typical Properties of TIF040AB-12S Series
Typical Uncured Material
Property Numerical Test Method
Color/Part A White Visual
Color/Part B Blue Visual
Viscosity as Mixed (cps) 1200,000 cps GB/T 10247
Density 3.1g/cc ASTM D792
Mix Ratio 1:1 ******
Shelf Life@25℃ 6 months ******
Cure Schedule
Pot Life @25℃ 30min ******
Cure @25℃ 60min ******
Cure @100℃ 30min ******
Cure Properties
Color Blue Visual
Hardness 45 shore 00 ASTM D2240
Continuous Use Temp -45~200℃ ******
Voltage Strength 200 V/mil ASTM D149
Dielectric Constant 3.9 MHz ASTM D150
Volume Resistivity 1012 Ohm-meter ASTM D257
Flame Rating 94V0 E331100
Thermal Conductivity 4.0 W/Mk ISO22007-2
Specific heat capacity 1.8 MJ/m³K ISO22007-2

Product packing details:


50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.

4.0W/mK Heat Sink Silicone Thermal Conductive Putty

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


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